Title :
3D integration technologies for emerging microsystems
Author :
Choudhury, Debabani
Author_Institution :
Intel Labs., Intel Corp., Hillsboro, OR, USA
Abstract :
The next generation of small form factor (SFF) microsystem technologies can only keep up with increased functionality and performance demands by using the third dimension. 3D integration technologies can be grouped into following distinct technology approaches: (i) 3D-monolithic IC integration, (ii) 3D stacking of IC-dies, wafers and packages, and (iii) 3D integrated packaging. This paper provides an overview on the various 3D integration and enabling technologies as well as the associated challenges that exist for SFF wireless system implementation with optimum cost and performance.
Keywords :
integrated circuit packaging; micromechanical devices; monolithic integrated circuits; radiocommunication; 3D integrated packaging; 3D stacking; 3D-monolithic IC integration; IC dies; IC packages; IC wafers; small form factor microsystem technologies; wireless system implementation; CMOS technology; Indium phosphide; Integrated circuit interconnections; Integrated circuit packaging; Integrated circuit technology; Monolithic integrated circuits; Semiconductor device packaging; Silicon; Stacking; Wireless sensor networks; 3D ICs; 3D integration; 3D packaging; Emerging Microsystems;
Conference_Titel :
Microwave Symposium Digest (MTT), 2010 IEEE MTT-S International
Conference_Location :
Anaheim, CA
Print_ISBN :
978-1-4244-6056-4
Electronic_ISBN :
0149-645X
DOI :
10.1109/MWSYM.2010.5514747
