3D integration technologies for emerging microsystems

Author

Choudhury, Debabani

Author_Institution

Intel Labs., Intel Corp., Hillsboro, OR, USA

fYear

2010

fDate

23-28 May 2010

Firstpage

1

Lastpage

4

Abstract

The next generation of small form factor (SFF) microsystem technologies can only keep up with increased functionality and performance demands by using the third dimension. 3D integration technologies can be grouped into following distinct technology approaches: (i) 3D-monolithic IC integration, (ii) 3D stacking of IC-dies, wafers and packages, and (iii) 3D integrated packaging. This paper provides an overview on the various 3D integration and enabling technologies as well as the associated challenges that exist for SFF wireless system implementation with optimum cost and performance.

Keywords

integrated circuit packaging; micromechanical devices; monolithic integrated circuits; radiocommunication; 3D integrated packaging; 3D stacking; 3D-monolithic IC integration; IC dies; IC packages; IC wafers; small form factor microsystem technologies; wireless system implementation; CMOS technology; Indium phosphide; Integrated circuit interconnections; Integrated circuit packaging; Integrated circuit technology; Monolithic integrated circuits; Semiconductor device packaging; Silicon; Stacking; Wireless sensor networks; 3D ICs; 3D integration; 3D packaging; Emerging Microsystems;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest (MTT), 2010 IEEE MTT-S International

Conference_Location

Anaheim, CA

ISSN

0149-645X

Print_ISBN

978-1-4244-6056-4

Electronic_ISBN

0149-645X

Type

conf

DOI

10.1109/MWSYM.2010.5514747

Filename

5514747