Title :
Material property characterization and integration issues for mesoporous silica
Author :
Ryan, E. Todd ; Huei-Min Ho ; Wu, Wen-li ; Ho, Paul S. ; Gidley, David W. ; Drage, Jim
Author_Institution :
Sematech, Austin, TX, USA
Abstract :
SEMATECH is driving the development of new characterization methodologies that are applicable to mesoporous materials. The results from the characterization of AlliedSignal´s first xerogel material (Nanoglass K2.2-A10B) illustrate the capabilities of these techniques. The characterization results, together with single-level metal Cu/damascene integration studies, demonstrate the issues involved with these potential ultra-low k materials
Keywords :
aerogels; integrated circuit interconnections; integrated circuit measurement; integrated circuit metallisation; integrated circuit reliability; permittivity; porosity; silicon compounds; Cu-SiO2; Nanoglass K2.2-A10B; characterization methodologies; integration issues; material property characterization; mesoporous materials; mesoporous silica; single-level metal Cu/damascene integration; ultra-low k materials; xerogel material; Dielectric constant; Dielectric materials; Inorganic materials; Material properties; Materials science and technology; Mesoporous materials; Optical films; Silicon compounds; Storage area networks; Thickness measurement;
Conference_Titel :
Interconnect Technology, 1999. IEEE International Conference
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-5174-6
DOI :
10.1109/IITC.1999.787117
