DocumentCode :
3085572
Title :
Surface control of interstitial behavior for improved ultrashallow junction formation
Author :
Seebauer, E.G.
Author_Institution :
Dept. of Chem. Eng., Illinois Univ., Urbana, IL, USA
fYear :
2004
fDate :
15-16 March 2004
Firstpage :
81
Lastpage :
86
Abstract :
There is increasing evidence that surface proximity effects must be incorporated into models for transient enhanced diffusion (TED). The present work examines the previously unrecognized influence that near-surface band bending can have on dopant profiles. Experiments employ the optical technique of photoreflectance to show that band bending exists at the Si-SiO2 interface just after implantation. The effects of such band bending are investigated numerically using a simulator whose rate parameters have been developed from literature data using Maximum Likelihood (ML) estimation together with multivariate statistics to quantify accuracy. The resulting simulator yields excellent fits of SIMS profiles with no freely adjustable parameters, and shows that band bending transforms interfaces into reflectors of charged interstitials (i.e., no flux), even if the interface would otherwise serve as a good sink for these defects. This transformation deepens the junction significantly and also induces the pileup of dopant very close to the interface.
Keywords :
boron; elemental semiconductors; interface structure; interstitials; ion implantation; photoreflectance; secondary ion mass spectra; semiconductor doping; silicon; silicon compounds; surface diffusion; Maximum Likelihood estimation; Si-SiO2; Si-SiO2 interface; band bending; charged interstitials; dopant profiles; improved ultrashallow junction formation; interstitial behavior; multivariate statistics; near-surface band bending; surface control; surface proximity effects; transient enhanced diffusion; Boundary conditions; Doping; Implants; Maximum likelihood estimation; Optical surface waves; Photonic band gap; Poisson equations; Reflectivity; Semiconductor process modeling; Space charge;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Junction Technology, 2004. IWJT '04. The Fourth International Workshop on
Print_ISBN :
0-7803-8191-2
Type :
conf
DOI :
10.1109/IWJT.2004.1306764
Filename :
1306764
Link To Document :
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