DocumentCode
3085575
Title
Characterization of plated via hole fences for isolation between stripline circuits in LTCC packages
Author
Ponchak, George E. ; Donghoon Chen ; Jong-Gwan Yook
Author_Institution
NASA Lewis Res. Center, Cleveland, OH, USA
Volume
3
fYear
1998
fDate
7-12 June 1998
Firstpage
1831
Abstract
Reduced coupling between adjacent striplines in LTCC packages is commonly accomplished by walls made of plated via holes. In this paper, a 3D-FEM electromagnetic simulation of stripline with filled via fences on both sides is presented. It is shown that the radiation loss of the stripline and the coupling between striplines increases if the fence is placed too close to the stripline.
Keywords
finite element analysis; packaging; strip line circuits; 3D FEM electromagnetic simulation; LTCC package; coupling; isolation; plated via hole fence; radiation loss; stripline circuit; Ceramics; Conducting materials; Costs; Coupling circuits; Dielectric losses; Distributed parameter circuits; Packaging; Radio frequency; Stripline; Strips;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 1998 IEEE MTT-S International
Conference_Location
Baltimore, MD, USA
ISSN
0149-645X
Print_ISBN
0-7803-4471-5
Type
conf
DOI
10.1109/MWSYM.1998.700838
Filename
700838
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