DocumentCode
3085653
Title
High contrast mark used for in-situ UV nano-imprint lithography allignment
Author
Li Ding ; Jin Qin ; Liang Wang
Author_Institution
Dept. of Opt. & Opt. Eng., Univ. of Sci. & Technol. of China, Hefei, China
fYear
2015
fDate
15-16 March 2015
Firstpage
1
Lastpage
4
Abstract
This paper focuses on designing a high contrast alignment mark used for imprint lithography in-liquid alignment. Since the imprint resist filled in the imprint pattern will deteriorate the intensity and contrast of the Moiré fringes, it´s hard to perform alignment based on the Moiré image. Through coating optically dens materials inside the imprint mask and changing the material, thickness, etch depth and grating pitch size, higher contrast can be obtained. Simulations based on Rigorous coupled-wave analysis (RCWA) are performed to calculate the reflection efficiency and contrast of obtained Moiré fringes. Experiments demonstrated that the simulation result is correct and feasible.
Keywords
moire fringes; nanolithography; ultraviolet lithography; Moire fringes; high contrast alignment mark; imprint resist; in-situ UV nano-imprint lithography alignment; reflection efficiency; rigorous coupled-wave analysis; Cameras; Heating; Iron; Liquids; Lithography; Optical reflection; Phase measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Technology International Conference (CSTIC), 2015 China
Conference_Location
Shanghai
ISSN
2158-2297
Type
conf
DOI
10.1109/CSTIC.2015.7153371
Filename
7153371
Link To Document