Title :
High frequency simulation and characterization of advanced copper interconnects
Author :
Cregut, Corinne ; Le Carval, Gilles ; Chilo, Jean
Author_Institution :
Snaketech, Voiron, France
Abstract :
In this paper, we evaluate the impact of copper on high frequency (HF) behavior for deep submicron interconnects. In particular, we compare aluminum vs. copper structures and study the association of copper with low-k dielectrics. Firstly, we use electromagnetic (EM) and electrical simulations to determine the necessary level of modeling. As a second step, we perform time domain characterization of dedicated devices. In this study, we measure the effective benefits in terms of crosstalk when combining copper and low-k
Keywords :
MMIC; circuit simulation; copper; crosstalk; dielectric thin films; integrated circuit interconnections; integrated circuit metallisation; integrated circuit modelling; integrated circuit testing; permittivity; time-domain analysis; Al; Cu; EM simulations; aluminum structures; copper interconnects; copper structures; copper/low-k interconnects; crosstalk; electrical simulations; electromagnetic simulations; high frequency characterization; high frequency simulation; interconnects; low-k dielectrics; modeling; time domain characterization; Aluminum; Circuit simulation; Copper; Crosstalk; Delay effects; Frequency; Hafnium; Integrated circuit interconnections; Microstrip; RLC circuits;
Conference_Titel :
Interconnect Technology, 1999. IEEE International Conference
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-5174-6
DOI :
10.1109/IITC.1999.787127
