Design centering in GaAs IC manufacturing

Author

Zurada, Jacek M. ; Lozowski, Andrzej ; Malinowski, Aleksander

Author_Institution

Dept. of Electr. Eng., Louisville Univ., KY, USA

Volume

2

fYear

1997

fDate

1-8 Feb 1997

Firstpage

435

Abstract

This paper describes a practical method of design centering for microelectronic, circuits fabrication process. Process data are first evaluated for principal components and subsequently modeled using multilayer perceptron networks in a reduced and transformed input space. Perceptron network models are then inverted, and center settings of input variables are computed by using the inverse PCA transformation. The approach allows for maximizing the yield of fabricated GaAs circuits used in aviation electronics systems. Example of yield maximization for MMIC fabrication data is provided to illustrate the proposed technique

Keywords

MMIC; circuit CAD; circuit optimisation; gallium arsenide; integrated circuit design; integrated circuit yield; military avionics; multilayer perceptrons; GaAs; GaAs IC manufacture; MMIC fabrication; MMIC fabrication data; aviation; aviation electronics; center settings; circuits fabrication; inverse PCA transformation; multilayer perceptron networks; perceptron network models; yield; yield maximization; Circuits; Computer networks; Design methodology; Fabrication; Gallium arsenide; Input variables; Manufacturing; Microelectronics; Multilayer perceptrons; Principal component analysis;

fLanguage

English

Publisher

ieee

Conference_Titel

Aerospace Conference, 1997. Proceedings., IEEE

Conference_Location

Snowmass at Aspen, CO

Print_ISBN

0-7803-3741-7

Type

conf

DOI

10.1109/AERO.1997.577992

Filename

577992