DocumentCode
3085866
Title
The projected power consumption of a wireless clock distribution system and comparison to conventional distribution systems
Author
Floyd, Brian A. ; O, K.K.
Author_Institution
Dept. of Electr. & Comput. Eng., Florida Univ., Gainesville, FL, USA
fYear
1999
fDate
1999
Firstpage
248
Lastpage
250
Abstract
A wireless interconnect system has been proposed for global clock signal distribution. The system transmits and receives signals at 20 GHz or higher. The received signal is then amplified, frequency divided to 4 GHz or lower, and buffered to provide a clock signal to the local clock distribution system. An analysis comparing the projected power dissipation of a wireless clock distribution system to conventional grid-based and H-tree based distribution systems for 0.1 μm generation microprocessors is performed, based on the total capacitive loading of the global distribution system. The results show that in terms of power dissipation, the wireless clock distribution system should be comparable to conventional systems
Keywords
MMIC; clocks; frequency convertors; integrated circuit interconnections; microprocessor chips; microwave receivers; radio receivers; radio transmitters; signal processing; 0.1 micron; 20 GHz; 4 GHz; H-tree based clock distribution systems; capacitive loading; clock distribution systems; clock signal; frequency division; global clock signal distribution; global distribution system; grid-based clock distribution systems; local clock distribution system; microprocessors; power consumption; received signal amplification; signal buffering; system signal reception; system signal transmission; wireless clock distribution system; wireless interconnect system; CMOS technology; Clocks; Energy consumption; Frequency conversion; Integrated circuit interconnections; Microprocessors; Power dissipation; Receiving antennas; Signal generators; System-on-a-chip;
fLanguage
English
Publisher
ieee
Conference_Titel
Interconnect Technology, 1999. IEEE International Conference
Conference_Location
San Francisco, CA
Print_ISBN
0-7803-5174-6
Type
conf
DOI
10.1109/IITC.1999.787135
Filename
787135
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