DocumentCode
3085953
Title
Comprehensive layout and process optimization study of Si and III-V technology for sub-7nm node
Author
Kang, C.Y. ; Baek, R.-H. ; Kim, Tae-Woo ; Ko, Dong Guk ; Kim, Do-Hyeon ; Michalak, T. ; Borst, Christopher ; Veksler, Dekel ; Bersuker, Gennadi ; Hill, Richard ; Hobbs, Chris ; Kirsch, P.D.
Author_Institution
SEMATECH, Albany, NY, USA
fYear
2013
fDate
9-11 Dec. 2013
Abstract
In this work we present III-V device performance and its variability under various design and process parameters, as compared to Si devices, using MC simulation. III-V device compact/BSIM models are developed, including geometry-dependent parasitic RC. Compared to its Si counterpart, III-V devices exhibit superior performance in Ion, ring oscillator delay (tpd) and SRAM read time (tread). We calculated the Nit target for mitigating increments of Ioff and subthreshold slopes. For both Si and III-V sub-7nm technology optimization, we propose a direction for technology design to improve performance and area scaling without variability penalty.
Keywords
III-V semiconductors; SRAM chips; elemental semiconductors; integrated circuit layout; optimisation; silicon; BSIM models; III-V device compact; III-V device performance; III-V technology; SRAM read time; Si; Si technology; comprehensive layout; geometry-dependent parasitic RC; process optimization; ring oscillator delay; size 7 nm; Analytical models; FinFETs; III-V semiconductor materials; Performance evaluation; Silicon; Solid modeling; Three-dimensional displays;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting (IEDM), 2013 IEEE International
Conference_Location
Washington, DC
Type
conf
DOI
10.1109/IEDM.2013.6724566
Filename
6724566
Link To Document