• DocumentCode
    3085953
  • Title

    Comprehensive layout and process optimization study of Si and III-V technology for sub-7nm node

  • Author

    Kang, C.Y. ; Baek, R.-H. ; Kim, Tae-Woo ; Ko, Dong Guk ; Kim, Do-Hyeon ; Michalak, T. ; Borst, Christopher ; Veksler, Dekel ; Bersuker, Gennadi ; Hill, Richard ; Hobbs, Chris ; Kirsch, P.D.

  • Author_Institution
    SEMATECH, Albany, NY, USA
  • fYear
    2013
  • fDate
    9-11 Dec. 2013
  • Abstract
    In this work we present III-V device performance and its variability under various design and process parameters, as compared to Si devices, using MC simulation. III-V device compact/BSIM models are developed, including geometry-dependent parasitic RC. Compared to its Si counterpart, III-V devices exhibit superior performance in Ion, ring oscillator delay (tpd) and SRAM read time (tread). We calculated the Nit target for mitigating increments of Ioff and subthreshold slopes. For both Si and III-V sub-7nm technology optimization, we propose a direction for technology design to improve performance and area scaling without variability penalty.
  • Keywords
    III-V semiconductors; SRAM chips; elemental semiconductors; integrated circuit layout; optimisation; silicon; BSIM models; III-V device compact; III-V device performance; III-V technology; SRAM read time; Si; Si technology; comprehensive layout; geometry-dependent parasitic RC; process optimization; ring oscillator delay; size 7 nm; Analytical models; FinFETs; III-V semiconductor materials; Performance evaluation; Silicon; Solid modeling; Three-dimensional displays;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting (IEDM), 2013 IEEE International
  • Conference_Location
    Washington, DC
  • Type

    conf

  • DOI
    10.1109/IEDM.2013.6724566
  • Filename
    6724566