Future scaling of Si based microelectronics and the role of consortia

Summary form only given. Semiconductor technology and its relentless scaling are at the core of many of the revolutionary gains humanity has witnessed in the last few decades. Future scaling options are promising, although complex and costly. Planar, Si-based materials integration for ever smaller devices has matured to heterointegration of non-Si materials today, and rapidly, scaling is moving to the 3rd dimension for devices and interconnects. Patterning technologies are pushing the limits of immersion-based deep UV technologies and are at the cusp of EUV technologies. Several options like nano imprint and directed self assembly are emerging to address cost and throughput issues.