Title :
1992 Proceedings. 42nd Electronic Components and Technology Conference (Cat. No.92CH3056-9)
Abstract :
The following topics are dealt with: trade-off/advanced packaging: manufacturing technology; optoelectronics (array technology); hybrid/MCM-C (multichip module-C) applications; adhesives; connectors; interconnections; solder; dielectric and MCM materials´ performance modeling: MCM materials and packaging technology; plastic packaging; encapsulants and molding compounds; optoelectronics (packaging technology); test and failure analysis; and single-chip packaging
Keywords :
electric connectors; electronic equipment manufacture; hybrid integrated circuits; multichip modules; optoelectronic devices; packaging; reliability; adhesives; advanced packaging; connectors; encapsulants; failure analysis; hybrid/MCM-C; interconnections; manufacturing technology; materials´ performance modeling; molding compounds; optoelectronics; plastic packaging; single-chip packaging; solder;
Conference_Titel :
Electronic Components and Technology Conference, 1992. Proceedings., 42nd
Conference_Location :
San Diego, CA, USA
Print_ISBN :
0-7803-0167-6
DOI :
10.1109/ECTC.1992.204167
