Multichip packaging technologies in IBM for desktop to mainframe computers

Author

Tummala, Rao R. ; Clark, Bernard T.

Author_Institution

IBM Corp., East Fishkill, NY, USA

fYear

1992

fDate

18-20 May 1992

Firstpage

1

Lastpage

9

Abstract

IBM currently manufactures six varieties of multichip module. They include air-cooled TCMs (thermal conduction modules) based on 63 layers of alumina-molybdenum with surface thin-film wiring, and water-cooled TCMs based on glass-ceramic/copper with thin-film redistribution. The four other multichips are all air-cooled and are based on ultradense thin film on silicon, high-density laminated printed wiring multichip with direct chip attach by flip-chip, and pinned, thin-film metallized multichip. The number of chips in these products ranges from 2 to 121, and the applications range from personal computers to mainframes

Keywords

IBM computers; flip-chip devices; mainframes; microcomputers; multichip modules; IBM; air-cooled TMCs; direct chip attach; flip-chip; laminated printed wiring multichip; mainframe computers; multichip module; personal computers; surface thin-film wiring; thermal conduction modules; thin-film metallized multichip; thin-film redistribution; water-cooled TCMs; Copper; Manufacturing; Metallization; Multichip modules; Packaging; Semiconductor thin films; Silicon; Thermal conductivity; Transistors; Wiring;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1992. Proceedings., 42nd

Conference_Location

San Diego, CA

Print_ISBN

0-7803-0167-6

Type

conf

DOI

10.1109/ECTC.1992.204174

Filename

204174