Title :
A study on the cutting track of diamond tips on the pad surface during CMP
Author :
Haiyu Kui ; Zongqing Yang
Author_Institution :
SY Micro-Electron. Tech. Ltd., Shenzhen, China
Abstract :
It becomes well known that CMP process doesn´t work without pad conditioning performed by the diamond disk. Doubtlessly, it´s significant to study how diamond particles cut the pad surface during CMP process. In this paper, we worked out the cutting track of one diamond tip on the pad surface with mathematical derivation.
Keywords :
chemical mechanical polishing; diamond; CMP; cutting track; diamond tips; mathematical derivation; pad surface; Diamonds; Mathematical model; Semiconductor device modeling;
Conference_Titel :
Semiconductor Technology International Conference (CSTIC), 2015 China
Conference_Location :
Shanghai
DOI :
10.1109/CSTIC.2015.7153422
