• DocumentCode
    3086819
  • Title

    A study on the cutting track of diamond tips on the pad surface during CMP

  • Author

    Haiyu Kui ; Zongqing Yang

  • Author_Institution
    SY Micro-Electron. Tech. Ltd., Shenzhen, China
  • fYear
    2015
  • fDate
    15-16 March 2015
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    It becomes well known that CMP process doesn´t work without pad conditioning performed by the diamond disk. Doubtlessly, it´s significant to study how diamond particles cut the pad surface during CMP process. In this paper, we worked out the cutting track of one diamond tip on the pad surface with mathematical derivation.
  • Keywords
    chemical mechanical polishing; diamond; CMP; cutting track; diamond tips; mathematical derivation; pad surface; Diamonds; Mathematical model; Semiconductor device modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Technology International Conference (CSTIC), 2015 China
  • Conference_Location
    Shanghai
  • ISSN
    2158-2297
  • Type

    conf

  • DOI
    10.1109/CSTIC.2015.7153422
  • Filename
    7153422
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3086819