Title :
Surface laminar circuit packaging
Author :
Tsukada, Yutaka ; Tsuchida, Syuhei ; Mashimoto, Yohko
Author_Institution :
IBM Japan, Shiga, Japan
Abstract :
Discusses the SLC (surface laminar circuit), a component carrier technology which satisfies various requirements for packaging of small computers through its surface laminar structure, which is similar to semiconductor wiring. By utilizing photo via holes instead of plated through holes for signal line connection, SLC has a high wiring density which allows it to carry bare chips directly attached on the SLC by flip chip attach. This packaging technology has an extended reliability compared with conventional flip chip bonding and a wide range of application in small computers
Keywords :
circuit reliability; flip-chip devices; packaging; wiring; SLC; bare chips; component carrier technology; flip chip attach; packaging; photo via holes; reliability; signal line connection; small computers; surface laminar circuit; wiring density; Application software; Bonding; Conductors; Costs; Electronics packaging; Flip chip; Pins; Printed circuits; Surface-mount technology; Wiring;
Conference_Titel :
Electronic Components and Technology Conference, 1992. Proceedings., 42nd
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-0167-6
DOI :
10.1109/ECTC.1992.204177
