• DocumentCode
    3086928
  • Title

    Atomic simulation of ion implantation into HfO2: LEACS vs. TSUPREM4

  • Author

    Shi, Hao ; Shi, Xiaokang ; Yu, Min ; Huang, Ru ; Zhang, Xing ; Wang, Yangyuan ; Suzuk, Kunihiro ; Oka, Hideki

  • Author_Institution
    Inst. of Microelectron., Peking Univ., Beijing, China
  • fYear
    2004
  • fDate
    15-16 March 2004
  • Firstpage
    331
  • Lastpage
    334
  • Abstract
    Traditional Monte Carlo ion implantation simulator TSUPREM4 is used to investigate ion implantation into HfO2, but cannot get satisfactory results. In this paper, an atomic simulator named LEACS is developed using molecular dynamics method. By virtue of considering the basic physical interactions more precisely and with only one fitting parameter rs0 named one electron radius used in the atomic simulator, it is found that LEACS rather than TSUPREM4 has a better precision in simulating ion implantations into HfO2. B, As and P implantations into HfO2 material in the energy range of ReV to 40 keV are simulated using LEACS. Very high accuracy is achieved in our simulation, which proves that molecular dynamics method is successfully implemented in our atomic simulator and the molecular dynamics method shows greater advantage than Monte Carlo method in TSUPREM4.
  • Keywords
    MOSFET; Monte Carlo methods; dielectric thin films; hafnium compounds; ion implantation; molecular dynamics method; semiconductor process modelling; HfO2; LEACS; MOSFET; Monte Carlo simulator; Newton force function; TSUPREM4; atomic simulator; binary collision; ion implantation simulator; molecular dynamics method; physical models; Atomic measurements; Electrons; Energy loss; Hafnium oxide; Ion implantation; Laboratories; MOSFET circuits; Microelectronics; Monte Carlo methods; Semiconductor process modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Junction Technology, 2004. IWJT '04. The Fourth International Workshop on
  • Print_ISBN
    0-7803-8191-2
  • Type

    conf

  • DOI
    10.1109/IWJT.2004.1306873
  • Filename
    1306873