DocumentCode :
3086928
Title :
Atomic simulation of ion implantation into HfO2: LEACS vs. TSUPREM4
Author :
Shi, Hao ; Shi, Xiaokang ; Yu, Min ; Huang, Ru ; Zhang, Xing ; Wang, Yangyuan ; Suzuk, Kunihiro ; Oka, Hideki
Author_Institution :
Inst. of Microelectron., Peking Univ., Beijing, China
fYear :
2004
fDate :
15-16 March 2004
Firstpage :
331
Lastpage :
334
Abstract :
Traditional Monte Carlo ion implantation simulator TSUPREM4 is used to investigate ion implantation into HfO2, but cannot get satisfactory results. In this paper, an atomic simulator named LEACS is developed using molecular dynamics method. By virtue of considering the basic physical interactions more precisely and with only one fitting parameter rs0 named one electron radius used in the atomic simulator, it is found that LEACS rather than TSUPREM4 has a better precision in simulating ion implantations into HfO2. B, As and P implantations into HfO2 material in the energy range of ReV to 40 keV are simulated using LEACS. Very high accuracy is achieved in our simulation, which proves that molecular dynamics method is successfully implemented in our atomic simulator and the molecular dynamics method shows greater advantage than Monte Carlo method in TSUPREM4.
Keywords :
MOSFET; Monte Carlo methods; dielectric thin films; hafnium compounds; ion implantation; molecular dynamics method; semiconductor process modelling; HfO2; LEACS; MOSFET; Monte Carlo simulator; Newton force function; TSUPREM4; atomic simulator; binary collision; ion implantation simulator; molecular dynamics method; physical models; Atomic measurements; Electrons; Energy loss; Hafnium oxide; Ion implantation; Laboratories; MOSFET circuits; Microelectronics; Monte Carlo methods; Semiconductor process modeling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Junction Technology, 2004. IWJT '04. The Fourth International Workshop on
Print_ISBN :
0-7803-8191-2
Type :
conf
DOI :
10.1109/IWJT.2004.1306873
Filename :
1306873
Link To Document :
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