DocumentCode
3086943
Title
High-density packaging: future outlook
Author
Buda, Leo R. ; Gedney, Ronald W. ; Kelley, Thomas F.
Author_Institution
IBM, Endicott, NY, USA
fYear
1992
fDate
18-20 May 1992
Firstpage
36
Lastpage
41
Abstract
Describes the general packaging outlook for the 1990s for primarily low-end to intermediate systems. It is pointed out that the key drivers on packaging are: (1) the trend towards higher performance which drives electrical and thermal design in a cost/performance environment; and (2) the trend toward portable and notebook systems which drives low weight and thin packages in a cost conscious environment. Attention is given to the SCM strategy, the MCM (multichip module) strategy, chip-on-board considerations, and wiring and surface area comparisons
Keywords
multichip modules; packaging; wiring; SCM strategy; chip-on-board considerations; cost/performance environment; electrical design; intermediate systems; low-end systems; notebook systems; surface area; thermal design; wiring; Bonding; Ceramics; Copper; Costs; Drives; Electronics packaging; Packaging machines; Plastic packaging; Semiconductor device packaging; Semiconductor devices;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1992. Proceedings., 42nd
Conference_Location
San Diego, CA
Print_ISBN
0-7803-0167-6
Type
conf
DOI
10.1109/ECTC.1992.204180
Filename
204180
Link To Document