Correlation of solderability failures of tin-plated parts with dissolved metal build-up in preclean bath

Author

Trabado, Flordeliza L. ; Ratilla, Eva Marie

Author_Institution

Intel Philippines Manuf. Inc., Makati Metro Manila, Philippines

fYear

1992

fDate

18-20 May 1992

Firstpage

66

Lastpage

71

Abstract

Evaluation of preclean baths that resulted in high solderability failures of tin plated parts revealed that specific gravity measurement and acid-base titration of sulfuric acid (H₂SO₄) are still insufficient to assess the effectiveness of the acid in etching the base metal. Ion chromatography analysis of dissolved metal buildup in preclean bath indicated levels of iron (Fe³⁺) and nickel (Ni²⁺) at 250 p.p.m. and 135 p.p.m., respectively. Beyond this point the solderability problem as assessed by the wetting balance begins. The use of the wetting balance method is being recommended to supplement the current dip and look method. Wetting balance is a quantitative test and it can therefore give information useful in estimating the defect location and identifying the source of the problem

Keywords

electronic equipment manufacture; electroplating; etching; soldering; surface treatment; acid-base titration; defect location; dip and look method; dissolved metal build-up; etching; ion chromatography analysis; preclean bath; solderability failures; specific gravity measurement; wetting balance; Etching; Gravity measurement; Iron; Lead; Manufacturing; Surface contamination; Temperature; Testing; Tin; Transducers;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1992. Proceedings., 42nd

Conference_Location

San Diego, CA

Print_ISBN

0-7803-0167-6

Type

conf

DOI

10.1109/ECTC.1992.204185

Filename

204185