DocumentCode
3087067
Title
Correlation of thickness measurements obtained from cross-sectioning and from X-ray fluorescence spectrometry
Author
Trabado, Flordeba L. ; Mendoza, J.S.
Author_Institution
Intel Philippines Manuf. Inc., Makati Metro Manila, Philippines
fYear
1992
fDate
18-20 May 1992
Firstpage
72
Lastpage
76
Abstract
Lead finish processes such as hot solder coat and solder plating differ in the deposit thickness distribution across the lead because of the surface thermodynamics of the system. Thickness measurements using the current methods of XRF (X-ray fluorescence) and cross-sectioning were evaluated. Results show that the thickness measurements using XRF correlate well with those obtained using cross-sectioning. However, cross-sectioning is more effective in solder dipped parts because of the nonuniform thickness distribution on the lead where the corner coverage is thinner than that at the center of the lead. XRF measurement of parts processed in solder coat can be influenced by obtaining measurements at the areas of the lead where the deposit is minimum and maximum
Keywords
X-ray fluorescence analysis; electroplating; production testing; soldering; thickness measurement; X-ray fluorescence spectrometry; XRF; corner coverage; cross-sectioning; hot solder coat; solder dipped parts; solder plating; surface thermodynamics; thickness measurements; Area measurement; Coatings; Electrical resistance measurement; Fluorescence; Lead; Semiconductor materials; Spectroscopy; Thermodynamics; Thickness measurement; Tin;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1992. Proceedings., 42nd
Conference_Location
San Diego, CA
Print_ISBN
0-7803-0167-6
Type
conf
DOI
10.1109/ECTC.1992.204186
Filename
204186
Link To Document