Title :
A low-cost manufacturing process for high-density hybrid components, based on multilayer polyimide/ceramic structures
Author :
Tudanca, M. ; Luna, R. Glz ; Fraile, A. ; Triana, J. ; Gonzalvez, J.M. ; Vincueria, I. ; Dominguez, C.
Author_Institution :
TELETTRA Spain, Madrid, Spain
Abstract :
A multichip module component manufacturing process combining multilayer polyimide and multilayer low-temperature cofired ceramic structures, using the latter as the encapsulation support, is described. A first characterization of the results is also reported. The procedures described make it possible to integrate resistances in thin/thick-film technology
Keywords :
ceramics; encapsulation; hybrid integrated circuits; integrated circuit manufacture; multichip modules; cofired ceramic; encapsulation support; high-density hybrid components; manufacturing process; multichip module component; multilayer polyimide/ceramic structures; resistance integration; thick-film technology; thin-film technology; Ceramics; Conducting materials; Conductive films; Dielectric substrates; Dielectric thin films; Gold; Manufacturing processes; Multichip modules; Nonhomogeneous media; Polyimides;
Conference_Titel :
Electronic Components and Technology Conference, 1992. Proceedings., 42nd
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-0167-6
DOI :
10.1109/ECTC.1992.204194
