DocumentCode
3087347
Title
Challenges in 3D memory manufacturing and process integration
Author
Chandrasekaran, Nivedita
Author_Institution
Micron Technol., Boise, ID, USA
fYear
2013
fDate
9-11 Dec. 2013
Abstract
Memory industry transition from planar to 3D scaling and the introduction of several new emerging memory devices into manufacturing over the next decade is going to drive several new and unique manufacturing and process integration challenges. The inflection point we are faced with is a new paradigm where advancements in materials science, non-litho equipment technology, testing and characterization methods, and control methodologies will lead the way for scaling cadence.
Keywords
DRAM chips; memory cards; quality control; reliability; 3D memory manufacturing; 3D scaling; materials science; memory industry transition; nonlitho equipment technology; process integration; Films; Manufacturing; Memory management; Random access memory; Three-dimensional displays; Through-silicon vias;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting (IEDM), 2013 IEEE International
Conference_Location
Washington, DC
Type
conf
DOI
10.1109/IEDM.2013.6724621
Filename
6724621
Link To Document