Title :
Development of mechanical fatigue test method for flip-chip solder joints
Author :
Doi, H. ; Kawano, K. ; Minamitani, R. ; Hatsuda, T. ; Hayashida, T.
Author_Institution :
Hitachi Ltd., Ibaraki, Japan
Abstract :
A controlled displacement mechanical fatigue test machine for specimens of flip-chip solder joints has been developed using PZT actuators. The extension response of the PZT exhibits good linearity using a charge control circuit. As a result of this control, errors in the strain of the specimen caused by the deflection of the test machine frame can be corrected by measuring the load. This test machine produces a cycle constant strain range in the solder joints. A fatigue test is conducted for specimens of flip-chip solder joints, and the fatigue strength of the joints is obtained. The strength of the joints seems to be higher than that of bulk solder
Keywords :
electric actuators; fatigue testing; flip-chip devices; soldering; PZT actuators; charge control circuit; cycle constant strain range; extension response; flip-chip solder joints; mechanical fatigue test method; test machine frame; Actuators; Capacitive sensors; Circuit testing; Displacement control; Error correction; Fatigue; Flip chip solder joints; Linearity; Strain control; Strain measurement;
Conference_Titel :
Electronic Components and Technology Conference, 1992. Proceedings., 42nd
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-0167-6
DOI :
10.1109/ECTC.1992.204202
