Title :
Reliability evaluation of high-pincount hermetic ceramic IC packages for space applications
Author :
Barrett, J. ; Hayes, T. ; Doyle, R. ; O´Mathuna, C. ; Yamada, T. ; Boetti, A.
Author_Institution :
Nat. Microeletron. Res. Center, Univ. Coll., Cork, Ireland
Abstract :
The results to date of a reliability testing program for the European Space Agency on high pincount hermetic ceramic packages are presented. Results are presented from work on: application of scanning acoustic microscopy (SAM) to die attach and lid seal quality assessment; the use of thermal characterization test chips and a computer-controlled thermal resistance measurement system to measure thermal impedances of ceramic quad flat pack (CQFP) and ceramic pin grid array (CPGA) packages; numerical prediction and practical measurement of electrical parasitics of CQFP and CPGA packages; quality and reliability testing of CQFP and CPGA packages; and quality and reliability testing of 20 and 25 mil pitch surface mount solder assemblies of high pincount CQFP packages assembled on printed circuit boards
Keywords :
acoustic microscopy; circuit reliability; packaging; quality control; seals (stoppers); surface mount technology; thermal resistance measurement; European Space Agency; ceramic pin grid array; ceramic quad flat pack; die attach; electrical parasitics; hermetic ceramic IC packages; lid seal quality; printed circuit boards; quality; reliability testing; scanning acoustic microscopy; space applications; surface mount solder assemblies; thermal characterization test chips; thermal resistance measurement system; Acoustic measurements; Acoustic testing; Ceramics; Circuit testing; Electric variables measurement; Electrical resistance measurement; Impedance measurement; Packaging; System testing; Thermal resistance;
Conference_Titel :
Electronic Components and Technology Conference, 1992. Proceedings., 42nd
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-0167-6
DOI :
10.1109/ECTC.1992.204206
