Title :
New type film-adhesives for microelectronics application
Author :
Sakamoto, Y. ; Takeda, N. ; Takeda, T. ; Tokoh, A. ; Tang, D.Y.
Author_Institution :
Sumitomo Bakelite Co. Ltd., Yokohama, Japan
Abstract :
Polyimidesiloxanes (SIM-X) were prepared and investigated in applications as film adhesive for microelectronics. SIM-X have low T g, low modulus, and low moisture absorption. A film composed of SIM-X and conductive filler (silver) shows good adhesion. It was found that the evaluated SIM was able to adhere to several adherends at lower temperature and under lower load than the usual condition. Applications to silver-filled film-adhesive for heatsink and die attachment were investigated. In the case of the heatsink, improvements of adhesive strength at high temperature and with PCT treatment were studied. The problems were solved in the following manner: (1) adhesion at higher temperature and (2) modification of the polymer. In the case of die attachment, the die rapidly adhered to leadframe at low temperature. This result indicates that inline attachment will be possible
Keywords :
adhesion; filled polymers; heat sinks; packaging; SIM-X; adhesive strength; conductive filler; die attachment; heatsink; inline attachment; leadframe; microelectronics application; moisture absorption; polyimidesiloxanes; Absorption; Adhesive strength; Conductive films; Impurities; Microelectronics; Moisture; Polyimides; Polymer films; Semiconductor films; Temperature;
Conference_Titel :
Electronic Components and Technology Conference, 1992. Proceedings., 42nd
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-0167-6
DOI :
10.1109/ECTC.1992.204209
