DocumentCode
3087522
Title
Simulation and modeling of power and ground planes in high speed printed circuit boards
Author
Mu, Zhen
Author_Institution
Sycamore Networks Inc., Chelmsford, MA, USA
Volume
5
fYear
2001
fDate
2001
Firstpage
459
Abstract
This paper describes an approach for the simulation and modeling of power and ground planes in high speed PCB design to guide de-coupling capacitor selection and placement and to achieve optimized designs. The described approach employs a mesh of transmission lines to model planes and can also be easily extended to irregular shaped planes
Keywords
capacitors; circuit layout CAD; circuit optimisation; printed circuit layout; de-coupling capacitor selection; ground planes; high speed PCB design; high speed printed circuit boards; irregular shaped planes; mesh; optimized designs; placement; power planes; transmission lines; Capacitors; Circuit simulation; Design optimization; Frequency; Impedance; Power transmission lines; Printed circuits; Resonance; Solid modeling; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Circuits and Systems, 2001. ISCAS 2001. The 2001 IEEE International Symposium on
Conference_Location
Sydney, NSW
Print_ISBN
0-7803-6685-9
Type
conf
DOI
10.1109/ISCAS.2001.922084
Filename
922084
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