DocumentCode :
3087566
Title :
Low-temperature die attach material
Author :
Smith, Charles ; Le, Kim ; Herrington, Tom ; Jeng, J.S. ; Akhtar, Masyood
Author_Institution :
Johnson Matthey Inc., San Diego, CA, USA
fYear :
1992
fDate :
18-20 May 1992
Firstpage :
234
Lastpage :
238
Abstract :
Describes the development of glasses for silver glass die attach application at temperature below 400° and as low as 260°C. It is observed that the basic principle of the nonbridging oxygen formulation mechanism can be used to design glasses in the development of new silver glass composites. These new composites were shown to perform at lower application temperatures with similar or better reliability than the original lead borate glass based silver composite. It was demonstrated that glass composition, glass transition temperature, and glass crystallization behavior were key to the ultimate performance of the composite
Keywords :
circuit reliability; composite materials; glass; packaging; silver; 260 to 400 degC; application temperatures; die attach application; glass composition; glass crystallization; glass transition temperature; reliability; Bonding; Crystallization; Glass; Microassembly; Packaging machines; Semiconductor device packaging; Silicon; Silver; Temperature; Viscosity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 1992. Proceedings., 42nd
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-0167-6
Type :
conf
DOI :
10.1109/ECTC.1992.204212
Filename :
204212
Link To Document :
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