DocumentCode
3087754
Title
Negative bias temperature instability lifetime prediction: Problems and solutions
Author
Ji, Zhen ; Hatta, S.F.W.M. ; Zhang, Jian F. ; Ma, J.G. ; Zhang, Wensheng ; Soin, Norhayati ; Kaczer, Ben ; De Gendt, Stefan ; Groeseneken, Guido
Author_Institution
Sch. of Eng., Liverpool John Moores Univ., Liverpool, UK
fYear
2013
fDate
9-11 Dec. 2013
Abstract
Lifetime of pMOSFETs is limited by NBTI. Conventional slow measurement overestimates lifetime due to recovery. The fast techniques suppress recovery, but cannot give reliable prediction. This work proposes a new lifetime prediction technique that overcomes the shortcomings of both slow and fast methods, based on the As-grown-Generation (AG) model. Its advantages over those based on Reaction-Diffusion (RD) and two-stage models include its simple algorithm, only two fitting parameters at a given temperature, and no need for a kinetic model for the as-grown hole traps. This makes it readily implementable in industrial laboratories for process screening.
Keywords
MOSFET; negative bias temperature instability; semiconductor device models; semiconductor device reliability; AG model; NBTI; RD model; as-grown hole traps; as-grown-generation model; industrial laboratory; lifetime prediction technique; negative bias temperature instability lifetime prediction; pMOSFET lifetime; process screening; reaction-diffusion model; two-stage models; Degradation; Educational institutions; Fitting; Reliability; Stress; Stress measurement; Velocity measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting (IEDM), 2013 IEEE International
Conference_Location
Washington, DC
Type
conf
DOI
10.1109/IEDM.2013.6724638
Filename
6724638
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