DocumentCode
3088041
Title
Reliability qualification test for circuit boards exposed to airborne hygroscopic dust
Author
Sandroff, Franpise S. ; Burnett, William H.
Author_Institution
Bellcore, Red Bank, NJ, USA
fYear
1992
fDate
18-20 May 1992
Firstpage
384
Lastpage
389
Abstract
The insulation resistance of circuit boards was monitored after different hygroscopic salts were deposited. By choosing different salts and concentrations, various resistance versus humidity characteristics were achieved. Insulation resistance as high as 1011 Ω was lowered to 106 Ω at 40% relative humidity after controlled contamination with calcium chloride. For purposes of designing a qualification tool to identify design robustness, the salt and contamination technique should give controllable and reproducible characteristics. Spin coating and spraying of atomized particulates were investigated. Sodium sulfide or, as alternatives, potassium carbonate or calcium chloride was identified as a suitable salt for the test. Although these materials are not typically found in airborne hygroscopic dust, their use offers a controllable means to simulate the loss of surface insulation resistance and the failures that can result. After being covered by the test salt, the board under test is plugged back into its host system via an extension card. The local environment around the circuit board is controlled and maintained at 25°C and high humidity. A functional test in normal operation of the circuit board is then performed
Keywords
circuit reliability; coating techniques; electric resistance; environmental degradation; environmental testing; failure analysis; humidity; printed circuit testing; 1 to 1×105 Mohm; 25 degC; CaCl2; K2CO3; Na2S; airborne hygroscopic dust; atomized particulates; circuit boards; contamination technique; controlled contamination; design robustness; failures; functional test; humidity; hygroscopic salts; qualification tool; reliability qualification test; resistance loss; spin coating; spraying; surface insulation resistance; Calcium; Circuit testing; Contamination; Humidity control; Insulation; Monitoring; Printed circuits; Qualifications; Surface resistance; System testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1992. Proceedings., 42nd
Conference_Location
San Diego, CA
Print_ISBN
0-7803-0167-6
Type
conf
DOI
10.1109/ECTC.1992.204236
Filename
204236
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