Title :
Inverse Source Solver for a High Resolution Near Field Scanner in Microelectronic Applications
Author :
Zhiru Yu ; Mei Chai ; Mix, Jason A. ; Slattery, Kevin P. ; Qing Huo Liu
Author_Institution :
Dept. of Electr. & Comput. Eng., Duke Univ., Durham, NC, USA
Abstract :
A potential application of inverse source solver for high resolution near field scanning of microelectronic packages is studied in this paper. A fast inverse source solver based on the fast Fourier transform algorithm and conjugate gradient algorithm is developed with a half-space Green´s function. This solver can be used in microelectronic applications to solve radiation related problems, including electromagnetic interference and signal integrity of printed circuit boards or integrated circuit packagings. Simulation results show a significant improvement in image resolution and adjacent sources detectability when the inverse source solver is applied. Because of the improvements, the inverse source solver reduces the sensitivity on scan height in the near field scan process when the same source image resolution is desired. Experiments on measured data also validate the effectiveness of this solver.
Keywords :
Green´s function methods; computational electromagnetics; conjugate gradient methods; electromagnetic interference; fast Fourier transforms; integrated circuit packaging; integrated circuit testing; adjacent sources detectability; conjugate gradient algorithm; electromagnetic interference; fast Fourier transform algorithm; half space Green function; high resolution near field scanner; image resolution; integrated circuit package; inverse source solver; microelectronic applications; microelectronic package; printed circuit board; radiation related problems; signal integrity; Electromagnetic interference; Green´s function methods; Image reconstruction; Image resolution; Inverse problems; Probes; Receivers; Current reconstruction; high resolution imaging; inverse problem; near field scanning;
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TCPMT.2014.2339357