DocumentCode
3088177
Title
The technology for over 300-pin QFPs
Author
Shirai, Yuji ; Otsuka, Kanji ; Okinaga, Takayuki ; Suzuki, Hiromichi ; Murakami, Gen ; Arai, Kiyokazu ; Satuu, Yuichi ; Emata, Takashi ; Matsunaga, Toshihiro
Author_Institution
Hitachi Ltd., Tokyo, Japan
fYear
1992
fDate
18-20 May 1992
Firstpage
423
Lastpage
428
Abstract
By merely changing the lead frame structure, high-performance QFPs (quad flat packages) were developed without any new technology. This technology makes successfully up to 304-pin QFPs. The lead frame structure is two layers for a high-speed signal and even for thermal management. The outer lead pitch is 0.5 mm. The 28-mm and 40-mm square body sizes are achieved in such a high pin count. The approach leads to low cost and high productivity and reliability
Keywords
integrated circuit technology; large scale integration; packaging; 0.5 mm; QFPs; high pin count; lead frame structure; outer lead pitch; quad flat packages; thermal management; Ambient intelligence; Bonding; Costs; Electronics packaging; Frequency; Inductance; Integrated circuit interconnections; Lead; Thermal management; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1992. Proceedings., 42nd
Conference_Location
San Diego, CA
Print_ISBN
0-7803-0167-6
Type
conf
DOI
10.1109/ECTC.1992.204242
Filename
204242
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