Title :
High-performance tape package
Author :
Fox, L. ; Davidson, C. ; Hansen, S. ; Brown, K. ; Oscilowski, A.
Author_Institution :
Digital Equipment Corp., Maynard, MA, USA
Abstract :
A high-pincount, high-power TAB (tape automated bonding) to board VLSI chip package is described. The package consists of a protective ceramic clamshell enclosing a TAB chip with 332 leads at 125 μm ILB (inner lead bond) pitch extending uninterrupted through the ceramic enclosure to the 0.3-mm pitch OLB (outer lead bond) zone configured for reflow soldering. The package body is clamped to the printed wiring board substrate by a spring-loaded heatsink providing good thermal conductance through a low-pressure separable interface. A 70-mm single site slide carrier tape format is employed to facilitate package assembly from ILB, die attach, clamshell bonding, through test and burn-in, and finally excise and leadform for OLB. A number of rigorous tests were used to qualify the package for use in the VAX4000/300
Keywords :
VLSI; integrated circuit technology; tape automated bonding; PWB substrate; TAB chip; VAX4000/300; VLSI chip package; high-pincount; high-power; inner lead bond; low-pressure separable interface; outer lead bond; printed wiring board; protective ceramic clamshell; reflow soldering; single site slide carrier tape format; spring-loaded heatsink; tape automated bonding; tape package; Bonding; Ceramics; Lead; Packaging; Protection; Reflow soldering; Testing; Thermal conductivity; Very large scale integration; Wiring;
Conference_Titel :
Electronic Components and Technology Conference, 1992. Proceedings., 42nd
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-0167-6
DOI :
10.1109/ECTC.1992.204244
