High-performance tape package

Author

Fox, L. ; Davidson, C. ; Hansen, S. ; Brown, K. ; Oscilowski, A.

Author_Institution

Digital Equipment Corp., Maynard, MA, USA

fYear

1992

fDate

18-20 May 1992

Firstpage

438

Lastpage

449

Abstract

A high-pincount, high-power TAB (tape automated bonding) to board VLSI chip package is described. The package consists of a protective ceramic clamshell enclosing a TAB chip with 332 leads at 125 μm ILB (inner lead bond) pitch extending uninterrupted through the ceramic enclosure to the 0.3-mm pitch OLB (outer lead bond) zone configured for reflow soldering. The package body is clamped to the printed wiring board substrate by a spring-loaded heatsink providing good thermal conductance through a low-pressure separable interface. A 70-mm single site slide carrier tape format is employed to facilitate package assembly from ILB, die attach, clamshell bonding, through test and burn-in, and finally excise and leadform for OLB. A number of rigorous tests were used to qualify the package for use in the VAX4000/300

Keywords

VLSI; integrated circuit technology; tape automated bonding; PWB substrate; TAB chip; VAX4000/300; VLSI chip package; high-pincount; high-power; inner lead bond; low-pressure separable interface; outer lead bond; printed wiring board; protective ceramic clamshell; reflow soldering; single site slide carrier tape format; spring-loaded heatsink; tape automated bonding; tape package; Bonding; Ceramics; Lead; Packaging; Protection; Reflow soldering; Testing; Thermal conductivity; Very large scale integration; Wiring;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1992. Proceedings., 42nd

Conference_Location

San Diego, CA

Print_ISBN

0-7803-0167-6

Type

conf

DOI

10.1109/ECTC.1992.204244

Filename

204244