DocumentCode
3088489
Title
Effect of the specimen size in predicting the mechanical properties of PbSn solder alloys
Author
Bonda, N.R. ; Noyan, I.C.
Author_Institution
IBM Technol. Products, Endicott, NY, USA
fYear
1992
fDate
18-20 May 1992
Firstpage
552
Lastpage
556
Abstract
The data obtained from bulk test specimens are often used in deformation models to predict the mechanical responses of parts that are very different in size and shape, such as solder joints in VLSI surface mount components. Such predictions are valid only if the size of the solder joints exceeds the representative deformation volume of the bulk specimens. In the present study, the measurement of the representative volume was performed for a single-phase solder alloy (98Pb-2Sn wt.%) deformed in both tension and cyclic loading. Deformation of 98Pb-2Sn alloy at room temperature was shown to be extremely inhomogeneous in both tensile and cyclic loading, and strain localization was observed at the grain boundaries. Strain distribution is more inhomogeneous in the specimen tested in fatigue than the specimen tested in uniaxial tension. This may be due to fatigue inhomogeneity in strain distribution or a small degree of buckling. The number of grains required for a representative volume of the 98Pb-2Sn alloy specimens tested is quite large
Keywords
fatigue testing; lead alloys; soldering; surface mount technology; tensile testing; tin alloys; 98Pb-2Sn alloy; PbSn solder; buckling; bulk test specimens; cyclic loading; deformation models; deformation volume; fatigue inhomogeneity; grain boundaries; mechanical properties prediction; number of grains; room temperature; single-phase solder alloy; solder alloys; solder joints; specimen size effect; strain distribution; strain localization; surface mount components; tensile loading; Deformable models; Fatigue; Mechanical factors; Performance evaluation; Predictive models; Shape memory alloys; Soldering; Testing; Very large scale integration; Volume measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1992. Proceedings., 42nd
Conference_Location
San Diego, CA
Print_ISBN
0-7803-0167-6
Type
conf
DOI
10.1109/ECTC.1992.204258
Filename
204258
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