• DocumentCode
    3088502
  • Title

    Torsional stiffness and fatigue study of surface-mounted compliant leaded systems

  • Author

    Engel, Peter A. ; Miller, Timothy M.

  • Author_Institution
    Dept. of Mech. & Ind. Eng., State Univ. of New York, Binghamton, NY, USA
  • fYear
    1992
  • fDate
    18-20 May 1992
  • Firstpage
    557
  • Lastpage
    562
  • Abstract
    Circuit cards with surface soldered compliant leaded modules are often subjected to torque tests to ensure their structural integrity. The authors explore the stiffness and fatigue behavior of such structures. A torsional load tester was devised, exerting cyclic mechanical torque at a desired fixed amplitude and frequency. Twisting loads up into the nonlinear load range were applied. Lead forces were computed by structural analysis methods, and these were compared with finite element results. The Engel-Ling coupled plate theory was found to correspond well to finite element results. Fatigue failures occurred in the solder for J-leads and in the leads for gullwings. Fatigue curves resembled the Coffin-Manson law
  • Keywords
    fatigue testing; finite element analysis; reliability; surface mount technology; Coffin-Manson law; Engel-Ling coupled plate theory; J-leads; SMT; circuit cards; cyclic mechanical torque; fatigue study; finite element results; gullwing leads; lead forces computation; structural analysis methods; structural integrity; surface-mounted compliant leaded systems; torque tests; torsional load tester; torsional stiffness study; Circuit testing; Coupling circuits; Fatigue; Finite element methods; Fixtures; Lead; Printed circuits; System testing; Torque; Vibrations;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 1992. Proceedings., 42nd
  • Conference_Location
    San Diego, CA
  • Print_ISBN
    0-7803-0167-6
  • Type

    conf

  • DOI
    10.1109/ECTC.1992.204259
  • Filename
    204259