Title :
Torsional stiffness and fatigue study of surface-mounted compliant leaded systems
Author :
Engel, Peter A. ; Miller, Timothy M.
Author_Institution :
Dept. of Mech. & Ind. Eng., State Univ. of New York, Binghamton, NY, USA
Abstract :
Circuit cards with surface soldered compliant leaded modules are often subjected to torque tests to ensure their structural integrity. The authors explore the stiffness and fatigue behavior of such structures. A torsional load tester was devised, exerting cyclic mechanical torque at a desired fixed amplitude and frequency. Twisting loads up into the nonlinear load range were applied. Lead forces were computed by structural analysis methods, and these were compared with finite element results. The Engel-Ling coupled plate theory was found to correspond well to finite element results. Fatigue failures occurred in the solder for J-leads and in the leads for gullwings. Fatigue curves resembled the Coffin-Manson law
Keywords :
fatigue testing; finite element analysis; reliability; surface mount technology; Coffin-Manson law; Engel-Ling coupled plate theory; J-leads; SMT; circuit cards; cyclic mechanical torque; fatigue study; finite element results; gullwing leads; lead forces computation; structural analysis methods; structural integrity; surface-mounted compliant leaded systems; torque tests; torsional load tester; torsional stiffness study; Circuit testing; Coupling circuits; Fatigue; Finite element methods; Fixtures; Lead; Printed circuits; System testing; Torque; Vibrations;
Conference_Titel :
Electronic Components and Technology Conference, 1992. Proceedings., 42nd
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-0167-6
DOI :
10.1109/ECTC.1992.204259