DocumentCode
3088502
Title
Torsional stiffness and fatigue study of surface-mounted compliant leaded systems
Author
Engel, Peter A. ; Miller, Timothy M.
Author_Institution
Dept. of Mech. & Ind. Eng., State Univ. of New York, Binghamton, NY, USA
fYear
1992
fDate
18-20 May 1992
Firstpage
557
Lastpage
562
Abstract
Circuit cards with surface soldered compliant leaded modules are often subjected to torque tests to ensure their structural integrity. The authors explore the stiffness and fatigue behavior of such structures. A torsional load tester was devised, exerting cyclic mechanical torque at a desired fixed amplitude and frequency. Twisting loads up into the nonlinear load range were applied. Lead forces were computed by structural analysis methods, and these were compared with finite element results. The Engel-Ling coupled plate theory was found to correspond well to finite element results. Fatigue failures occurred in the solder for J-leads and in the leads for gullwings. Fatigue curves resembled the Coffin-Manson law
Keywords
fatigue testing; finite element analysis; reliability; surface mount technology; Coffin-Manson law; Engel-Ling coupled plate theory; J-leads; SMT; circuit cards; cyclic mechanical torque; fatigue study; finite element results; gullwing leads; lead forces computation; structural analysis methods; structural integrity; surface-mounted compliant leaded systems; torque tests; torsional load tester; torsional stiffness study; Circuit testing; Coupling circuits; Fatigue; Finite element methods; Fixtures; Lead; Printed circuits; System testing; Torque; Vibrations;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1992. Proceedings., 42nd
Conference_Location
San Diego, CA
Print_ISBN
0-7803-0167-6
Type
conf
DOI
10.1109/ECTC.1992.204259
Filename
204259
Link To Document