• DocumentCode
    3088593
  • Title

    Statistical spectroscopy of switching traps in deeply scaled vertical poly-Si channel for 3D memories

  • Author

    Toledano-Luque, Maria ; Degraeve, Robin ; Roussel, P.J. ; Luong, Van-Su ; Tang, Bo-Hui ; Lisoni, J.G. ; Tan, C.-L. ; Arreghini, A. ; Van den bosch, G. ; Groeseneken, Guido ; Van Houdt, J.

  • Author_Institution
    Imec, Leuven, Belgium
  • fYear
    2013
  • fDate
    9-11 Dec. 2013
  • Abstract
    For future high density storage memories, 3D vertical poly-Si channel SONOS devices are emerging as the most prominent alternative because of the extreme reduction of cost per bit (1-3). This architecture, however, faces critical reliability issues related to the highly defective channel (4-5). For instance, we recently showed that discrete current drops and fluctuations (RTN) are clearly observed in the transfer characteristics (ID vs. VG) of these nanoscale vertical nFETs (Fig. 1). These instabilities were linked to single electron trapping/detrapping processes (6-7), which potentially may cause read errors during operation (4-5). The present paper therefore aims at characterizing these adverse switching traps to gain insight into their physical properties. A statistical comparison among different polysilicon channels is presented and benchmarked against monocrystalline planar nFETs. We reveal that a significant part of the switching traps reside in the poly-Si channel.
  • Keywords
    elemental semiconductors; field effect transistors; integrated memory circuits; silicon; three-dimensional integrated circuits; 3D memories; 3D vertical poly-Si channel SONOS devices; Si; high density storage memories; monocrystalline planar nFET; nanoscale vertical nFET; single electron trapping/detrapping processes; statistical spectroscopy; switching traps; Charge carrier processes; Couplings; Flash memories; Fluctuations; Switches; Three-dimensional displays; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting (IEDM), 2013 IEEE International
  • Conference_Location
    Washington, DC
  • Type

    conf

  • DOI
    10.1109/IEDM.2013.6724676
  • Filename
    6724676