Title :
Use of low cost plastic DIPs and injection molded parts in packaging of optical data links
Author :
Acarlar, M.S. ; Moyer, S.L. ; Robinson, S.D.
Author_Institution :
AT&T Bell Lab., Breinigsville, PA, USA
Abstract :
A novel, low-cost version of the ODL 125 optical data link has been developed in response to market needs. This packaging scheme offers a low-cost, high-performance solution for the growing FDDI (Fiber Distributed Data Interface) market. The ODL 125 Series II data link operates at 125 MB/s and uses long-wavelength (1.3-μm) optics. The ST connectorized package is pin-compatible with the existing ODL 125 Data Link. This package consists of an injection-molded type of housing, OSA (optical subassembly), TO-type headers, a 16-pin plastic DIP, and a stamped metal cover-all low-cost, high-volume, mature packaging technologies. In addition, the assembled package is plotted to allow for wave soldering and aqueous cleaning. The authors focus on the package design and performance results of the preproduction models. In addition, they discuss design alternatives such as the use of conductive plastics for EMI shielding
Keywords :
FDDI; optical couplers; optical links; packaging; plastics; shielding; 1.3 micron; 125 Mbit/s; EMI shielding; FDDI; ODL 125 optical data link; aqueous cleaning; conductive plastics; high-performance; injection-molded type of housing; low-cost; optical subassembly; packaging scheme; plastic DIP; preproduction models; stamped metal cover; wave soldering; Costs; Electronics packaging; FDDI; High speed optical techniques; Integrated circuit packaging; Optical distortion; Optical receivers; Optical sensors; Optical transmitters; Plastic packaging;
Conference_Titel :
Electronic Components and Technology Conference, 1992. Proceedings., 42nd
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-0167-6
DOI :
10.1109/ECTC.1992.204274
