DocumentCode :
3088730
Title :
Atomic migration in phase change materials
Author :
Novielli, G. ; Ghetti, Andrea ; Varesi, E. ; Mauri, A. ; Sacco, Riccardo
Author_Institution :
Process R&D, Micron Technol. Inc., Agrate Brianza, Italy
fYear :
2013
fDate :
9-11 Dec. 2013
Abstract :
During normal operation of Phase Change Memory (PCM) cells active materials undergo very high electrical and thermal stresses that cause a motion of the different atoms leading to composition variation which has a fundamental impact on performance and reliability. In order to address this issue we introduce here a comprehensive 3D physical model for mass transport in chalcogenide materials. In addition to the driving force for atom diffusion coming from concentration gradient and electric field, the model also accounts for the effect of temperature gradient and phase segregation. This new diffusion model is coupled with a calibrated electro-thermal-phase change model, thus providing a unified framework for the self-consistent simulation of both the electro-thermal and the phase/material change problems. The model is applied to the study of different types of PCM cells showing good agreement with experiments and demonstrating in particular the fundamental role played by the temperature profile.
Keywords :
SCF calculations; chalcogenide glasses; electromigration; phase change materials; phase change memories; thermal stresses; 3D physical model; PCM active materials; ätomic migration; atom diffusion; atom motion; chalcogenide materials; composition variation; concentration gradient; diffusion model; electric field; electrical stress; electrothermal problems; electrothermal-phase change model; mass transport; phase change materials; phase change memory cells; phase segregation; phase-material change problems; self-consistent simulation; temperature gradient effect; thermal stress; Atomic measurements; Heating; Liquids; Phase change materials; Solid modeling; Solids;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting (IEDM), 2013 IEEE International
Conference_Location :
Washington, DC
Type :
conf
DOI :
10.1109/IEDM.2013.6724683
Filename :
6724683
Link To Document :
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