Electrical characteristics of multichip module interconnects with perforated reference planes

A quasi-TEM (transverse electromagnetic) approach is demonstrated for the equivalent transmission line characterization of multichip-module (MCM) interconnects with perforated (mesh) reference planes. The proposed method can be used to obtain effective transmission line parameters for both single and coupled interconnects, which in turn can be used directly in SPICE-like waveform simulator tools for an overall electrical analysis of complex MCM interconnect nets. Comparisons with experimental results obtained from the literature, as well as results obtained from full-wave modeling of the interconnect structures, demonstrate the validity of the proposed approach and help define the frequency range of its accuracy