DocumentCode :
3089085
Title :
Rapid thermal curing of BCB dielectric
Author :
Garrou, P.E. ; Heistand, R.H. ; Dibbs, M. ; Manial, T.A. ; Mohler, C. ; Stokich, T. ; Townsend, P.H. ; Adema, G.M. ; Berry, M.J. ; Turlik, I.
Author_Institution :
Dow Chemical USA, Charlotte, NC, USA
fYear :
1992
fDate :
18-20 May 1992
Firstpage :
770
Lastpage :
775
Abstract :
The authors demonstrate the feasibility of rapid thermal curing (RTC) of benzocyclobutene (BCB) thin films using an infrared belt furnace. The effects on film properties resulting from a dramatic reduction in cure time (5 h to 5 min) are summarized. The extent of cure was determined by FTIR (Fourier-transform infrared spectroscopy) and was subsequently modeled as a function of reaction kinetics using the measured temperature profiles. FTIR spectra from the RTC films were identical to those obtained using a conventional inert gas oven and a convectively heated belt furnace, indicating that: (1) the polymerization mechanisms and the resulting polymer network structure are identical, and (2) no chemical enhancement of the curing occurs due to the absorption of infrared radiation. There are no statistically significant differences in the resulting stress and adhesion properties for samples cured by the RTC process vs. the conventional process for film thicknesses ranging from 1 to 24 μm. Planarization measurements, made on isolated features up to 100 μm in width, also indicate no differences in the cured films
Keywords :
multichip modules; polymer films; polymer structure; polymerisation; rapid thermal processing; reaction kinetics; spectrochemical analysis; 1 to 24 micron; 5 min; FTIR spectra; MCM; benzocyclobutene thin films; cure time; infrared belt furnace; planarisation; polymer network structure; polymerization mechanisms; rapid thermal curing; reaction kinetics; temperature profiles; Belts; Curing; Dielectric thin films; Furnaces; Infrared heating; Infrared spectra; Kinetic theory; Ovens; Polymer films; Temperature measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 1992. Proceedings., 42nd
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-0167-6
Type :
conf
DOI :
10.1109/ECTC.1992.204292
Filename :
204292
Link To Document :
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