Title :
Optoelectronic chips and multichip modules
Author :
Jannson, Tomasz ; Chen, Ray ; Lin, Freddie
Author_Institution :
Phys. Optics Corp., Torrance, CA, USA
Abstract :
A novel concept of optoelectronic chips and multichip modules (MCMs) is presented. This concept is based on direct integration of single-mode optoelectronics with VLSI/ULSI CMOS technology. This concept allows direct communication between silicon chips and modules without implementing GaAs electronics. External electrooptic (EO) modulators and silicon photodetectors are used as transceivers while optical power is provided by continuous wave (CW) laser diodes (LDs). In analogy with multilayer MCM electrical interconnects, multilayer optical interconnects are provided in the form of polymeric light-distributing interconnect-active (LIDIA) substrates. As a result, the integrated waveguide technology is monolithically integrated through LIDIA intrachip, chip-to-chip, and module-to-module substrates with silicon MCM circuitry
Keywords :
CMOS integrated circuits; VLSI; integrated optoelectronics; multichip modules; optical interconnections; Si photodetectors; VLSI/ULSI CMOS technology; direct integration; external electrooptic modulators; integrated waveguide technology; monolithically integrated; multichip modules; multilayer optical interconnects; optoelectronic chips; polymeric light-distributing interconnect-active; single-mode optoelectronics; substrates; transceivers; CMOS technology; Electrooptic modulators; Integrated circuit interconnections; Multichip modules; Nonhomogeneous media; Optical interconnections; Optical polymers; Optical waveguides; Silicon; Very large scale integration;
Conference_Titel :
Electronic Components and Technology Conference, 1992. Proceedings., 42nd
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-0167-6
DOI :
10.1109/ECTC.1992.204298
