DocumentCode
3089496
Title
Factors governing the loop profile in Au bonding wire
Author
Ohno, Yasuhide ; Ohzeki, Yoshio ; Aso, Toshiro ; Kitamura, Osamu
Author_Institution
Nippon Steel Corp., Japan
fYear
1992
fDate
18-20 May 1992
Firstpage
899
Lastpage
902
Abstract
It is found by studying the factors governing the loop profile in Au bonding wires that the thermal history in forming the ball caused the observed V-shaped hardness distribution in the heat affected zone. It is proved by combining calculation and simulation that the minimum hardness portion is a dominant factor governing the loop height. As recent LSI packaging is becoming thinner and thinner, a low profile wire is required for the bonding wire, which can be developed by utilizing this approach
Keywords
gold; hardness; integrated circuit technology; large scale integration; lead bonding; packaging; Au bonding wire; LSI packaging; V-shaped hardness distribution; bonding wire; heat affected zone; loop profile; low profile wire; simulation; Bonding; Doping; Gold; Grain size; Large scale integration; Mechanical factors; Neck; Packaging; Resins; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1992. Proceedings., 42nd
Conference_Location
San Diego, CA
Print_ISBN
0-7803-0167-6
Type
conf
DOI
10.1109/ECTC.1992.204313
Filename
204313
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