DocumentCode :
3089589
Title :
Investigation of the physical mechanisms governing data-retention in down to 10nm nano-trench Al2O3/CuTeGe conductive bridge RAM (CBRAM)
Author :
Guy, J. ; Molas, G. ; Vianello, E. ; Longnos, F. ; Blanc, Sara ; Carabasse, C. ; Bernard, M. ; Nodin, J.F. ; Toffoli, A. ; Cluzel, Jacques ; Blaise, P. ; Dorion, P. ; Cueto, O. ; Grampeix, H. ; Souchier, E. ; Cabout, Thomas ; Brianceau, P. ; Balan, Viorel
Author_Institution :
LETI, CEA, Grenoble, France
fYear :
2013
fDate :
9-11 Dec. 2013
Abstract :
In this work, we present an experimental and theoretical analysis of scaled (down to 10nm) Al2O3/CuTeGe based CBRAM. We focus on the understanding of the physical mechanisms responsible for the failure of high and low resistance states at high temperature. Using a numerical model combined with ab-initio calculations, we elucidate for the 1st time at our knowledge the role of the filament morphology on the resistance instability. We demonstrate that an optimized filament shape (tuned by adjusting the operating conditions) significantly improves the memory window stability at high temperatures.
Keywords :
aluminium compounds; circuit stability; copper compounds; nanoelectronics; random-access storage; tellurium compounds; Al2O3-CuTeGe; CBRAM; data retention; filament morphology; high resistance state stability; low resistance state stability; memory window stability; nanotrench conductive bridge RAM; numerical model; optimized filament shape; resistance instability; size 10 nm; Aluminum oxide; Electrodes; Morphology; Random access memory; Resistance; Stability analysis; Tin;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting (IEDM), 2013 IEEE International
Conference_Location :
Washington, DC
Type :
conf
DOI :
10.1109/IEDM.2013.6724722
Filename :
6724722
Link To Document :
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