Title :
The thermal management of IBM´s ES/9000 advanced thermal conduction module
Author :
Hopper, Gregory S. ; Edwards, David L. ; Young, Steven P.
Author_Institution :
IBM Technol. Products, Hopewell Junction, NY, USA
Abstract :
The Advanced Thermal Conduction Module (ATCM) used in the IBM ES/9000 mainframe models 820 and 900 represents a major step forward in high end thermal management. Advanced design, sophisticated modeling, application of new materials, thorough testing, and joint development with manufacturing have resulted in a threefold increase in cooling capability over the TCM in the 3090. The use of a composite heat transfer coefficient is introduced and used to compare several thermal designs. The authors describe the ATCM technology, design process, and qualification activity that led to the introduction of the ATCM
Keywords :
IBM computers; cooling; heat transfer; mainframes; modules; IBM ES/9000 mainframe models; advanced thermal conduction module; composite heat transfer coefficient; cooling capability; design process; high end thermal management; qualification activity; thermal management; Conducting materials; Cooling; Heat transfer; Joining materials; Materials testing; Process design; Qualifications; Thermal conductivity; Thermal management; Virtual manufacturing;
Conference_Titel :
Electronic Components and Technology Conference, 1992. Proceedings., 42nd
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-0167-6
DOI :
10.1109/ECTC.1992.204327
