Title :
Simulation of enhanced hole ballistic velocity in asymmetrically strained Germanium nanowire trigate p-MOSFETs
Author :
Teherani, James T. ; Chern, Wei-Ting ; Antoniadis, Dimitri A. ; Hoyt, Judy L.
Author_Institution :
MIT Microsyst. Technol. Labs., Cambridge, MA, USA
Abstract :
The impact of asymmetric strain in Ge nano wire (NW) trigate p-MOSFETs with record measured hole mobility [1] is simulated. Contrary to previous studies of uniaxial and biaxial strain, the impact of very large (2.4%), non-uniform asymmetric strain (achieved by patterning-induced lateral relaxation) is studied through NW simulations. Asymmetric strain significantly warps the valence band (VB), reducing the hole effective mass in the transport direction, and increasing the ballistic velocity (νθ ∝ √m* [2], [3]) compared to biaxial strain. Consistent with previous mobility measurements [1], analysis of the VB strucuture reveals a 1.6× increase in the inverse effective mass for a 49-nm wide asymmetrically-strained Ge NW compared to planar biaxially strained Ge (s-Ge) with 2.4% compressive strain. νθ improves in narrow NWs due to lateral strain relaxation that reduces the transport effective mass. A νθ enhancement of 2.8X relative to unstrained Si (1.6× relative to 1% uniaxially strained Si) is predicted for 10-nm wide s-Ge NWs suggesting a scalable transport enhancement technique for future technology nodes.
Keywords :
MOSFET; elemental semiconductors; germanium; hole mobility; nanopatterning; nanowires; silicon; Ge; Si; biaxial strain; germanium nanowire; hole ballistic velocity; hole effective mass; hole mobility; lateral strain relaxation; nonuniform asymmetric strain; patterning-induced lateral relaxation; scalable transport enhancement technique; size 10 nm; size 49 nm; trigate p-MOSFET; uniaxial strain; valence band; Dielectrics; Dispersion; Effective mass; Logic gates; MOSFET circuits; Silicon; Strain;
Conference_Titel :
Electron Devices Meeting (IEDM), 2013 IEEE International
Conference_Location :
Washington, DC
DOI :
10.1109/IEDM.2013.6724737