DocumentCode
3089951
Title
The application of laser process technology to thin film packaging
Author
Redmond, T.F. ; Lankard, J.R. ; Balz, J.G. ; Proto, G.R. ; Wassick, T.A.
Author_Institution
IBM E. Fishkill Facility, Hopewell Junction, NY, USA
fYear
1992
fDate
18-20 May 1992
Firstpage
1066
Lastpage
1071
Abstract
Laser process technologies have been developed which are well suited to the manufacture of thin film electronic packages. The authors discuss three technologies-laser ablation, laser-assisted metal etching, and laser chemical vapor deposition-and how they can be used in polymer and metal patterning. Process and tooling considerations as well as specific applications are presented
Keywords
chemical vapour deposition; etching; laser ablation; laser beam machining; laser deposition; packaging; laser ablation; laser chemical vapor deposition; laser process technology; laser-assisted metal etching; metal patterning; polymer patterning; thin film packaging; tooling considerations; Chemical lasers; Chemical technology; Electronics packaging; Etching; Laser ablation; Laser applications; Laser beams; Optical materials; Polymer films; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1992. Proceedings., 42nd
Conference_Location
San Diego, CA
Print_ISBN
0-7803-0167-6
Type
conf
DOI
10.1109/ECTC.1992.204338
Filename
204338
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