Title :
The application of laser process technology to thin film packaging
Author :
Redmond, T.F. ; Lankard, J.R. ; Balz, J.G. ; Proto, G.R. ; Wassick, T.A.
Author_Institution :
IBM E. Fishkill Facility, Hopewell Junction, NY, USA
Abstract :
Laser process technologies have been developed which are well suited to the manufacture of thin film electronic packages. The authors discuss three technologies-laser ablation, laser-assisted metal etching, and laser chemical vapor deposition-and how they can be used in polymer and metal patterning. Process and tooling considerations as well as specific applications are presented
Keywords :
chemical vapour deposition; etching; laser ablation; laser beam machining; laser deposition; packaging; laser ablation; laser chemical vapor deposition; laser process technology; laser-assisted metal etching; metal patterning; polymer patterning; thin film packaging; tooling considerations; Chemical lasers; Chemical technology; Electronics packaging; Etching; Laser ablation; Laser applications; Laser beams; Optical materials; Polymer films; Transistors;
Conference_Titel :
Electronic Components and Technology Conference, 1992. Proceedings., 42nd
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-0167-6
DOI :
10.1109/ECTC.1992.204338
