DocumentCode
3090250
Title
Dynamic Co-operative Intelligent Memory
Author
Wen, Xiaoyong ; Bensaali, Faycal ; Sotudeh, Reza
Author_Institution
Univ. of Hertfordshire, Hatfield
fYear
2008
fDate
23-25 Jan. 2008
Firstpage
184
Lastpage
189
Abstract
As semiconductor technology advances, the performance gap between processor and memory has become one of the major issues in computer design. In order to bridge this gap, many methods, for example, cache, Massively Parallel Processor (MPP) and interleaved memory have been developed. However, computer system performance fails to make reasonable improvement in the data intensive applications, due to the long latency and limited bandwidth. In a continuing effort to bridge this widening gap between processor and main memory speed, a new concept called Processor-In-Memory (PIM) is introduced, which capitalises on merging the processor unit with its memory unit on the same chip. Several architectures based on this concept have been proposed such as, IRAM, Active Pages, FlexRAM, Computational RAM, etc. The most immediate benefit provided by these architectures is the increased on chip bandwidth and low memory latency. These architectures have some limitations such as their adaptability, scalability and cost-effectiveness. In this paper, a Dynamic Cooperative Intelligent Memory (DCIM) architecture is presented, where some of those limitations are bridged.
Keywords
cache storage; interleaved storage; microprocessor chips; parallel processing; random-access storage; semiconductor technology; FlexRAM; IRAM; active pages; cache; computational RAM; computer system; data intensive; dynamic cooperative intelligent memory; interleaved memory; massively parallel processor; processor-in-memory; semiconductor technology; Application software; Bandwidth; Bridges; Computer architecture; Delay; Merging; Random access memory; Read-write memory; Scalability; System performance;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Design, Test and Applications, 2008. DELTA 2008. 4th IEEE International Symposium on
Conference_Location
Hong Kong
Print_ISBN
978-0-7695-3110-6
Type
conf
DOI
10.1109/DELTA.2008.33
Filename
4459537
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