• DocumentCode
    3091061
  • Title

    Technology trends for future low cost phased arrays

  • Author

    Sarcione, M. ; Puzella, A.

  • Author_Institution
    Raytheon Company, Sudbury, United States
  • fYear
    2010
  • fDate
    23-28 May 2010
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    The next generation of active electronically scanned arrays (AESAs) is dependent upon many technology and application pulls and the pushes. RF and manufacturing technologies are key elements of achieving more affordable phased arrays in support of both military and commercial applications. Advanced, evolving, mature and even revolutionary device, material and packaging technologies are making significant strides for lowering the cost of phased arrays. To date, phased array usage has been limited to high end military and commercial applications. That´s about to change with the evolution of more affordable AESA architectures that take advantage of RF microelectronics, surface mount RF packaging and new architectures focused on reducing the high cost drivers. New Panel AESA approaches promise a savings of more than 50% since the initial nearly 20 years ago.
  • Keywords
    Costs; Electronics packaging; Laboratories; Manufacturing; Microelectronics; Phase change materials; Phased arrays; Radio frequency;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium Digest (MTT), 2010 IEEE MTT-S International
  • Conference_Location
    Anaheim, CA
  • ISSN
    0149-645X
  • Print_ISBN
    978-1-4244-6056-4
  • Electronic_ISBN
    0149-645X
  • Type

    conf

  • DOI
    10.1109/MWSYM.2010.5515004
  • Filename
    5515004