• DocumentCode
    3091067
  • Title

    2-D row-column CMUT arrays with an open-grid support structure

  • Author

    Christiansen, Thomas Lehrmann ; Dahl-Petersen, Christian ; Jensen, John A. ; Thomsen, Erik V.

  • Author_Institution
    Dept. of Micro- & Nanotechnol., Tech. Univ. of Denmark, Lyngby, Denmark
  • fYear
    2013
  • fDate
    21-25 July 2013
  • Firstpage
    1712
  • Lastpage
    1715
  • Abstract
    Fabrication and characterization of 64 + 64 2-D row-column addressed CMUT arrays with 250 μm element pitch and 4.4 MHz center frequency in air incorporating a new design approach is presented. The arrays are comprised of two wafer bonded, structured silicon-on-insulator wafers featuring an open-grid support structure on top of the CMUT plates, omitting the need for through wafer vias. A 5 mask process is used to produce 2-D row-column addressed CMUT arrays with 74 nm vacuum gaps, single crystalline silicon plates with optional lithographically defined mass loads, 120 V pull-in voltage, and high voltage insulation up to 310 V.
  • Keywords
    capacitive sensors; silicon-on-insulator; ultrasonic transducer arrays; 2D row-column CMUT arrays; CMUT plates; capacitive micromachined ultrasonic transducers; frequency 4.4 MHz; open-grid support structure; single crystalline silicon plates; structured silicon-on-insulator wafers; Bonding; Electrodes; Insulation; Resonant frequency; Silicon-on-insulator; Voltage measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium (IUS), 2013 IEEE International
  • Conference_Location
    Prague
  • ISSN
    1948-5719
  • Print_ISBN
    978-1-4673-5684-8
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2013.0436
  • Filename
    6724790