DocumentCode
3091067
Title
2-D row-column CMUT arrays with an open-grid support structure
Author
Christiansen, Thomas Lehrmann ; Dahl-Petersen, Christian ; Jensen, John A. ; Thomsen, Erik V.
Author_Institution
Dept. of Micro- & Nanotechnol., Tech. Univ. of Denmark, Lyngby, Denmark
fYear
2013
fDate
21-25 July 2013
Firstpage
1712
Lastpage
1715
Abstract
Fabrication and characterization of 64 + 64 2-D row-column addressed CMUT arrays with 250 μm element pitch and 4.4 MHz center frequency in air incorporating a new design approach is presented. The arrays are comprised of two wafer bonded, structured silicon-on-insulator wafers featuring an open-grid support structure on top of the CMUT plates, omitting the need for through wafer vias. A 5 mask process is used to produce 2-D row-column addressed CMUT arrays with 74 nm vacuum gaps, single crystalline silicon plates with optional lithographically defined mass loads, 120 V pull-in voltage, and high voltage insulation up to 310 V.
Keywords
capacitive sensors; silicon-on-insulator; ultrasonic transducer arrays; 2D row-column CMUT arrays; CMUT plates; capacitive micromachined ultrasonic transducers; frequency 4.4 MHz; open-grid support structure; single crystalline silicon plates; structured silicon-on-insulator wafers; Bonding; Electrodes; Insulation; Resonant frequency; Silicon-on-insulator; Voltage measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium (IUS), 2013 IEEE International
Conference_Location
Prague
ISSN
1948-5719
Print_ISBN
978-1-4673-5684-8
Type
conf
DOI
10.1109/ULTSYM.2013.0436
Filename
6724790
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