• DocumentCode
    3091148
  • Title

    Effect of Implantation Defects and Carbon Incorporation on Si/SiGe Bipolar Characteristics

  • Author

    Bouhouche, M. ; Latreche, S. ; Gontrand, C.

  • Author_Institution
    Dept. Electron., Univ. de Constantine, Constantine, Algeria
  • Volume
    2
  • fYear
    2009
  • fDate
    28-30 Dec. 2009
  • Firstpage
    201
  • Lastpage
    204
  • Abstract
    Incorporation of carbon in SiGe has attracted great interest, which makes SiGeC based heterojunction transistors as an attractive device for high frequency applications. Carbon addition in SiGe dramatically reduces out-diffusion of boron caused by excess of interstitials generated by extrinsic base implantation. However carbon incorporation negatively influences the electrical device characteristics. In this paper we investigate active implantation defects, the aim was to the specify space localization and parasitic effects of this ones. Second, we investigate the impact of carbon content on the electrical characteristics of device, the results show that indeed C contents ¿ 1% severely degrade transistor performances.
  • Keywords
    Ge-Si alloys; carbon; diffusion; elemental semiconductors; heterojunction bipolar transistors; interstitials; p-n heterojunctions; semiconductor device models; semiconductor doping; silicon; Si-SiGe:C; bipolar characteristics; boron out-diffusion; carbon incorporation; electrical characteristics; extrinsic base implantation; heterojunction transistors; high-frequency applications; implantation defects; interstitials; parasitic effects; space localization; Boron; CMOS technology; Capacitive sensors; Degradation; Electric variables; Germanium silicon alloys; Heterojunction bipolar transistors; Modeling; Photonic band gap; Silicon germanium; Band gap; Carbon; HBT; ISE-TCAD; SiGe; active defects;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer and Electrical Engineering, 2009. ICCEE '09. Second International Conference on
  • Conference_Location
    Dubai
  • Print_ISBN
    978-1-4244-5365-8
  • Electronic_ISBN
    978-0-7695-3925-6
  • Type

    conf

  • DOI
    10.1109/ICCEE.2009.180
  • Filename
    5380214