• DocumentCode
    309166
  • Title

    Properties and processing of AVATRELTM as a high performance dielectric

  • Author

    Grove, N.R. ; Kohl, P.A. ; Bidstrup-Allen, S.A. ; Shick, R.A. ; Goodall, B.L. ; Jayaraman, S.

  • Author_Institution
    Georgia Inst. of Technol., Atlanta, GA, USA
  • fYear
    1997
  • fDate
    2-4 Apr 1997
  • Firstpage
    224
  • Lastpage
    227
  • Abstract
    The development of low dielectric constant materials for interlevel dielectrics is necessary to meet the demands of the microelectronics industry. A family of materials derived from polynorbornene is being developed as interlevel dielectrics. These materials are functionalized to give excellent adhesion, good elongation to break, and low stress while maintaining their low dielectric constant. In order to understand the effect of the functionalization on the properties of the polymer, a series of materials with different compositions are being investigated. The properties of these films will be used to optimize the cyclic polyolefin composition
  • Keywords
    adhesion; dielectric thin films; multichip modules; permittivity; polymer films; AVATREL; MCM; adhesion; cyclic polyolefin; high performance dielectric; interlevel dielectrics; low dielectric constant materials; polymer; polynorbornene; Adhesives; Dielectric constant; Dielectric materials; Dielectric substrates; Inorganic materials; Microelectronics; Moisture; Polyimides; Polymer films; Thermal stability;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Multichip Modules, 1997., International Conference on
  • Conference_Location
    Denver, CO
  • Print_ISBN
    0-7803-3787-5
  • Type

    conf

  • DOI
    10.1109/ICMCM.1997.581179
  • Filename
    581179
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=309166