Infrared-Light Interference System Based on Linnik-Type Interferometric Microscope for Three-Dimension Profile Measurement

Author

Chou, Xiujian ; Niu, Kangkang ; Liu, Yi ; Xue, Chenyang ; Zhang, Wendong

Author_Institution

Key Lab. of Instrum. Sci. & Dynamic Meas., North Univ. of China, Taiyuan, China

fYear

2010

fDate

17-19 Sept. 2010

Firstpage

640

Lastpage

643

Abstract

Infrared-light interference system for three-dimension profile measurement is proposed in this paper. The measurement system comprises infrared-light halogen source, linnik-type interferometric microscope, infrared-light InGaAs CCD array camera and ceramic piezo. With transmission to GaAs wafer, measured three-dimension profile and steps heights of microstructure are highly consistent with the results obtained from famous commercial instrument MSA 400 via Stoilov phase-stepping algorithm. The system has widely potential applications in the field of MEMS, such as reconstructing the internal profile measurement of encapsulation devices and analyzing the quality evaluation of bonding interface based on semiconductor materials.

Keywords

CCD image sensors; III-V semiconductors; gallium arsenide; indium compounds; infrared sources; light interferometry; optical microscopy; spatial variables measurement; GaAs; GaAs wafer; InGaAs; Linnik-type interferometric microscope; MEMS; Stoilov phase-stepping algorithm; bonding interface; ceramic piezo; encapsulation devices; infrared-light CCD array camera; infrared-light halogen source; infrared-light interference system; internal profile measurement; microstructure; semiconductor materials; three-dimension profile measurement; Gallium arsenide; Interference; Microscopy; Optical interferometry; Optimized production technology; Semiconductor device measurement; Thickness measurement; Stoilov phase-stepping algorithm; infrared-light interference system; three-dimension profile;

fLanguage

English

Publisher

ieee

Conference_Titel

Pervasive Computing Signal Processing and Applications (PCSPA), 2010 First International Conference on

Conference_Location

Harbin

Print_ISBN

978-1-4244-8043-2

Electronic_ISBN

978-0-7695-4180-8

Type

conf

DOI

10.1109/PCSPA.2010.160

Filename

5636067