Title :
Packaging issues for next generation high voltage, high temperature power electronic modules
Author :
Bowers, John S. ; Hopkins, Douglas C. ; Sarjeant, W. James
Author_Institution :
Custom Electron. Inc., Oneonta, NY, USA
Abstract :
This paper describes packaging issues related to the next generation of high voltage (>2 kV), high temperature (200°C to 400°C) power electronic modules that are being developed for military, commercial and industrial applications. These applications include space, nuclear power and down-hole systems. Components, materials and processes are considered. Effects due to variations in thickness of the copper interconnect, ceramic substrate and heat spreader (baseplate) are investigated to predict the effects of thermally induced stresses. Thinner ceramic layers provide a significant increase in the thermal conductance and lower thermally induced stresses during system operation
Keywords :
heat sinks; integrated circuit interconnections; integrated circuit packaging; power integrated circuits; thermal analysis; thermal conductivity; 200 to 400 C; applications; ceramic substrate; copper interconnect; heat spreader; high temperature; packaging issues; power electronic modules; thermal conductance; thermally induced stresses; Ceramics; Conducting materials; Defense industry; Electronics industry; Electronics packaging; Power electronics; Temperature; Thermal conductivity; Thermal stresses; Voltage;
Conference_Titel :
Applied Power Electronics Conference and Exposition, 1997. APEC '97 Conference Proceedings 1997., Twelfth Annual
Conference_Location :
Atlanta, GA
Print_ISBN :
0-7803-3704-2
DOI :
10.1109/APEC.1997.581483
